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Sputtering Targets

Sputtering uses low heat to create a superior bond between the sputter source (made of the coating material) and the substrate (the surface to be coated). The process creates a uniform thin-film coating on flat and non-flat surfaces and is primarily used in creating reflective and non-reflective surfaces and to enhance corrosion resistance, wear resistance and electrical capabilities.

The advantages of sputter coating:

Sputter coating offers significant advantages over other methods of coating and plating. Most notably:

  • It results in a more durable and uniform coating than can be achieved by plating.
  • In high-vacuum applications, its large target masses necessitate fewer changeovers, making sputter coating a more maintenance-free process.
  • The composition of the coating is very close to the composition of the target material.
  • Because there is no need for chemicals in the process, sputter coating is more environment-friendly than electroplating.
  • It is less costly than other methods of coating such as electroplating.
  • Unlike evaporation, which only deposits material from the bottom up, sputtering can also occur from the top down direction, leading to more uniform coating.
  • The deposit film thicknesses can be finely controlled by adjusting the deposition time and other parameters.

Bonded or non-bonded?

XRF Scientific can supply either bonded or non-bonded targets, depending on your needs. Using bonded targets:

  • Prevents the warping of target materials.
  • Allows for the water-cooling of the target material.
  • Allows for fixation to certain vacuum units.

HIPIMS (High-power impulse magnetron sputtering)

  • High Target Utilization Sputtering.
  • Reactive Sputtering.
  • Ion Beam Sputtering.
  • PVD Sputtering.

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